● High Thermal Conductivity: Ensures efficient heat transfer to maintain optimal temperatures.
● Strong Adhesion: Excellent bonding strength to a variety of surfaces providing durability and stability.
● Wide Temperature Range: Operates effectively in temperatures from -20°C to 120°C making it suitable for various environments.
● Flexibility and Conformability: Easily conforms to irregular surfaces ensuring comprehensive coverage.
● Thin Profile: With a thickness of 0.2mm it allows for space-efficient thermal management solutions.
1 Surface Preparation: Clean and dry the surfaces to be bonded ensuring they are free from dust grease and contaminants.
2 Tape Application: Cut the tape to the required length and remove the protective liner.
3 Positioning: Carefully position the tape on the surface ensuring proper alignment and smooth application without wrinkles or air bubbles.
4 Pressure Application: Apply firm pressure to the tape to ensure strong adhesion and optimal contact.
5 Curing (if necessary): Allow the adhesive to cure for the recommended time to achieve maximum bonding strength.| Testing Item | Unit | Testing Value | Testing Method |
| Substrate | - | Glass Fabric | - |
| Colour | - | White | Visual |
| Thickness | MM | 0.2 | - |
| Peel Strengthunder180° | (PSTC-101)(N/25MM) | ＞15 | PSTC-1 |
| Retention | （1KG/INCH/25℃） | ＞48 | PSTC-1 |
| Adhesion | KG/IN | 1.4 | PSTC-1 |
| Initial Viscosity | KG/IN | 1.3 | PSTC-1 |
| Breakdown Voltage | KV/MM | 3.5 | ASTMD149 |
| Long-termHighest Temperature resistance | ℃ | 80 | EN344 |
| Short-termHighest Temperature | ℃ | 120 | EN344 |
| Working Temperature | ℃ | -20～120 | EN344 |
| Conductivity | W/M.K | ≥1.2 | ASTMD5470 |
