● High Thermal Conductivity: 1.2W/m.k ensuring effective heat transfer and dissipation
● Strong Adhesion: Delivers excellent bonding strength to diverse surfaces
● Temperature Resilience: Capable of withstanding extreme high and low temperatures
● Flexibility and Conformability: Adapts easily to various surface contours and shapes
● Thin Profile: At 0.3mm thickness it provides efficient thermal management without occupying significant space
1 Surface Preparation: Ensure the surfaces to be bonded are clean dry and free from dust grease and other contaminants
2 Tape Application: Cut the tape to the required size and remove the protective liner
3 Positioning: Accurately position the tape on the target surface avoiding wrinkles and air bubbles
4 Pressure Application: Apply firm and even pressure to the tape to secure a strong bond and optimal contact
5 Curing (if required): Allow the adhesive to cure for the specified time to achieve maximum bonding strength| Testing Item | Unit | Testing Value | Testing Method |
| Substrate | - | Glass Fabric | - |
| Colour | - | White | Visual |
| Thickness | MM | 0.3 | - |
| Peel Strengthunder180° | (PSTC-101)(N/25MM) | ＞17 | PSTC-1 |
| Retention | （1KG/INCH/25℃） | ＞48 | PSTC-1 |
| Adhesion | KG/IN | 1.5 | PSTC-1 |
| Initial Viscosity | KG/IN | 1.3 | PSTC-1 |
| Breakdown Voltage | KV/MM | 6 | ASTMD149 |
| Long-term Highest Temperature resistance | ℃ | 80 | EN344 |
| Short-term Highest Temperature | ℃ | 120 | EN344 |
| Working Temperature | ℃ | -20～120 | EN344 |
| Conductivity | W/M.K | ≥1.2 | ASTM D5470 |
