0.4mm Thermal Conductive Adhesive Tape High-Temperature Resistant Fiberglass Base for Heat Dissipation in Renewable Energy Systems NFION

0.4mm Thermal Conductive Adhesive Tape High-Temperature Resistant Fiberglass Base for Heat Dissipation in Renewable Energy Systems NFION

  • 0.4mm Thermal Conductive Adhesive Tape High-Temperature Resistant Fiberglass Base for Heat Dissipation in Renewable Energy Systems NFION
  • 0.4mm Thermal Conductive Adhesive Tape High-Temperature Resistant Fiberglass Base for Heat Dissipation in Renewable Energy Systems NFION
Summary
NFION's 0.4mm Thermal Conductive Adhesive Tape, featuring a high-strength fiberglass base and 1.2W/m·K thermal conductivity, delivers reliable thermal management for critical components in renewable energy systems. Engineered to withstand extreme temperatures (-20 to 120°C), this tape ensures efficient heat dissipation and structural integrity in applications such as solar inverters, battery energy storage systems, and wind turbine electronics. Its thin, conformable profile and strong adhesion make it ideal for compact, high-performance environments where durability and thermal stability are essential.More
Specifications
Material:
Glass fiber
Thermal Conductivity:
1.2W/m.k
Temperature Resistance:
-20-120℃
  • 0.4mm Thermal Conductive Adhesive Tape High-Temperature Resistant Fiberglass Base for Heat Dissipation in Renewable Energy Systems NFION

● Strong Adhesion: Provides excellent bonding strength to a variety of surfaces

● Thermal Conductivity: Ensures effective heat transfer with a thermal conductivity of 1.2W/m.k

● Temperature Resilience: Capable of withstanding high and low temperature extremes

● Tear Resistance: Enhanced durability with resistance to tearing, thanks to the fiberglass cloth base

● Flexibility and Conformability: Easily adapts to various shapes and surfaces

● Thin Profile: At 0.4mm thickness, it offers efficient thermal management without taking up too much space

● Computer and Server Systems: Enhances heat dissipation in CPUs and GPUs, maintaining optimal operating temperatures ● Medical Devices: Ensures reliable thermal management in sensitive electronic medical equipment ● Telecommunication Equipment: Provides effective heat transfer in networking hardware and devices ● Renewable Energy Systems: Manages heat in solar panels and wind turbine components ● Aerospace Electronics: Offers robust thermal management in avionics and other aerospace electronic systems
Testing ItemUnitTesting ValueTesting Method
Substrate-Glass Fabric-
Colour-WhiteVisual
ThicknessMM0.4-
Peel Strengthunder180°(PSTC-101)(N/25MM)18PSTC-1
Retention1KG/INCH/2548PSTC-1
AdhesionKG/IN1.5PSTC-1
Initial ViscosityKG/IN1.4PSTC-1
Breakdown VoltageKV/MM6.5ASTMD149
Long-termHighest Temperature resistance80EN344
Short-termHighest Temperature120EN344
Working Temperature-20120EN344
ConductivityW/M.K≥1.2ASTM D5470
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