High Thermal Conductivity: With a thermal conductivity of 1.5W/M.K this gel ensures excellent heat transfer reducing the risk of overheating and enhancing the efficiency of electronic components
One-part Formulation: The single-component design simplifies the application process eliminating the need for mixing and curing thus saving time and reducing the potential for errors
High Stability and Reliability: The gel maintains its thermal performance over a wide temperature range ensuring consistent and reliable operation even in demanding conditions
Low Thermal Resistance: The gel minimizes thermal resistance at the interface ensuring efficient heat transfer between components and heatsinks
| Testing Item | Unit | Testing Value | Testing Method |
| Component | - | Silicone&Thermal Powder | - |
| Colour | - | White or Customized | Visual |
| Density | G/CC | 2.3 | ASTM D1475 |
| Thermal Resistance | ℃*IN2/W | 0.18 | ASTM D5470 |
| Extrusion Flow Rate | G/MIN | 35 | 2.54MM 90PSI |
| Weight Loss | % | ＜0.5 | @200℃240H |
| Working Temperature | ℃ | -40~200 | EN344 |
| Mini interface Thickness | MM | 0.09 | - |
| Flammability | - | V-0 | UL 94 |
| Thermal Conductivity | W/M.K | 1.5 | ASTM D5470 |
