flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems

flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems

Vincotech China
  • flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems
  • flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems
  • flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems
  • flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems
Summary
flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3-phase Advanced Neutral PFC ensures high-efficiency power conversion for renewable energy systems. Featuring IGBT F5 chip technology, temperature sensor, and Al2O3 base isolation, it delivers ultra-fast switching, low losses, and reliable thermal performance. Ideal for energy storage and battery applications requiring superior efficiency and durability.More
  • flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems
  • flowPIM 1 + 3xPFC 1200V 15A Open Emitter Inverter Module with 3ph Advanced Neutral PFC for High-Efficiency Power Systems

Basic module information

Part number:10-FE12APA015SH01-PB18E08Z
Product line:flowPIM 1 + 3xPFC
Product status:Series - Preferred
Break down voltage:1200 V
Nominal chip current rating:15 A
Standard Packing Quantity:100
Module datasheet:PDF, 5MB

Product details

Topology:PIM+3xPFC (CIP)
  • Open Emitter configuration
  • Temperature sensor
  • Inverter
  • 3ph Advanced Neutral PFC
Chip technology (main switch):IGBT F5
  • Highest efficiency in hard switching and resonant topologies
  • Lowest switching losses
  • Optimized for ultra-fast switching
Base isolation (e.g. ceramic):Al2O3
Electrical interconnection:Press-fit pin

Housing related details

Module housing:flow1
Mechanical connection to the PCB:4 towers
Footprint:82 mm x 37.4 mm
Height:12mm
  • Convex shaped substrate for superior thermal contact
  • Thermo-mechanical push-and-pull force relief
  • Press-fit pin
  • Reliable cold welding connection
Download
REQUEST MORE DETAILS
Please fill out the form below and click the button to request more information about
Fill out the form below to make an inquiry
Company*
Country/Region*
FirstName*
LastName*
Email*
Whatsapp/Phone*
Product Description*
Verification code*
We needs the contact information you provide to us to contact you about our products and services.
If your supplier does not respond within 24 hours, we will connect you with three to five qualified alternative suppliers.
我們使用 Cookie 來改善您的線上體驗。 繼續瀏覽本網站,即表示您同意我們使用 Cookie