flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications

flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications

Vincotech China
  • flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications
  • flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications
  • flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications
  • flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications
Summary
flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications. Designed for high-performance power conversion systems in renewable energy and industrial applications, this compact PIM module integrates a converter, brake, and inverter in one housing. Featuring IGBT4 chip technology, low saturation voltage, and short tail current, it ensures high efficiency and reliability. The Al2O3 base isolation and press-fit pin design enable superior thermal contact and mechanical stability, ideal for demanding environments.More
  • flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications
  • flowPIM E1 1200V 15A Open Emitter Power Module with Temperature Sensor for Converter Brake Inverter Applications

Basic module information

Part number:10-EZ12PMA015SC-L928A08T
Product line:flowPIM E1
Product status:Series
Break down voltage:1200 V
Nominal chip current rating:15 A
Standard Packing Quantity:100
Module datasheet:PDF, 9 MB
Additional information
  • Equivalent: IFX FP15R12W1T4_B11

Product details

Topology:PIM (CIB)
  • Open Emitter configuration
  • Temperature sensor
  • Converter+Brake+Inverter
Chip technology (main switch):IGBT4
  • Easy paralleling
  • Low turn-off losses
  • Low collector emitter saturation voltage
  • Positive temperature coefficient
  • Short tail current
Base isolation (e.g. ceramic):Al2O3
Electrical interconnection:Press-fit pin

Housing related details

Module housing:flow E1
Mechanical connection to the PCB:4 towers
Footprint:62.8 mm x 34.8 mm
Height:12 mm
  • Convex shaped substrate for superior thermal contact
  • Compact housing
  • CTI600 housing material
  • Thermo-mechanical push-and-pull force relief
  • Press-fit pin
  • Reliable cold welding connection
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