● High Thermal Conductivity: Efficiently transfers heat to ensure optimal performance and longevity of electronic components.
● Strong Adhesion: Provides excellent bonding strength to various surfaces ensuring durability and stability.
● Flexibility and Conformability: Easily conforms to irregular surfaces and contours for versatile application.
● Thin Profile: At just 0.15mm thick it allows for compact and efficient heat management solutions.
1、Surface Preparation: Ensure that the surfaces to be bonded are clean dry and free from dust and grease.
2、Tape Application: Cut the tape to the desired length and remove the protective liner.
3、Positioning: Carefully position the tape on the target surface ensuring alignment and avoiding wrinkles or air bubbles.
4、Pressure Application: Apply firm pressure to the tape to ensure good adhesion and contact with the surface.
| Testing Item | Unit | Testing Value | Testing Method |
| Substrate | - | Glass Fabric | - |
| Colour | - | White | Visual |
| Thickness | MM | 0.15 | - |
| Peel Strengthunder180° | (PSTC-101)(N/25MM) | ＞14 | PSTC-1 |
| Retention | （1KG/INCH/25°C） | ＞48 | PSTC-1 |
| Adhesion | KG/IN | 1.4 | PSTC-1 |
| Initial Viscosity | KG/IN | 1.3 | PSTC-1 |
| Breakdown Voltage | KV/MM | 2.5 | ASTMD149 |
| Long-termHighest Temperature resistance | °C | 80 | EN344 |
| Short-termHighest Temperature | °C | 120 | EN344 |
| Working Temperature | °C | -20°C～120°C | EN344 |
| Conductivity | W/M.K | ≥1.2 | ASTMD5470 |
