● Dual-Sided Adhesion: Offers strong bonding on both sides, ensuring reliable thermal interface
● High Thermal Conductivity: Efficiently transfers heat with a thermal conductivity of 1.2W/m.k
● Temperature Tolerance: Operates effectively in a wide temperature range from -20 to 120℃
● Tear Resistance: Enhanced durability with resistance to tearing, thanks to the fiberglass base
● Robust Adhesion: Provides superior adhesion strength to a variety of surfaces
● Flexibility and Conformability: Easily conforms to irregular surfaces for comprehensive coverage
● Power Electronics: Ideal for use in power converters and modules where efficient heat transfer is critical
● Computer Components: Enhances thermal management in CPUs, GPUs, and other high-performance computing elements
● Consumer Electronics: Applied in smartphones, tablets, and other devices to manage heat effectively
● Industrial Machinery: Ensures reliable heat dissipation in various types of industrial equipment
● Telecommunications Hardware: Manages heat in communication devices and networking equipment
| Testing Item | Unit | Testing Value | Testing Method |
| Substrate | - | Glass Fabric | - |
| Colour | - | White | Visual |
| Thickness | MM | 0.5 | - |
| Peel Strengthunder180° | (PSTC-101)(N/25MM) | ＞19 | PSTC-1 |
| Retention | （1KG/INCH/25℃） | ＞48 | PSTC-1 |
| Adhesion | KG/IN | 1.5 | PSTC-1 |
| Initial Viscosity | KG/IN | 1.5 | PSTC-1 |
| Breakdown Voltage | KV/MM | 7 | ASTM D149 |
| Long-term Highest Temperature resistance | ℃ | 80 | EN 344 |
| Short-term Highest Temperature | ℃ | 120 | EN 344 |
| Working Temperature | ℃ | -20～120 | EN 344 |
| Conductivity | W/M.K | ≥1.2 | ASTM D5470 |
