Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION

Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION

  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
Summary
NFION 0.7mm Thermal Conductive Adhesive Tape with 1.2W/m·K thermal conductivity offers strong dual-sided bonding and fiberglass reinforcement, ideal for heat sink attachment in power electronics, battery systems, and energy storage applications. With temperature resistance from -20°C to 120°C, excellent tear resistance, and electrical insulation, this tape ensures reliable thermal management and structural integrity in demanding environments.More
Specifications
Material:
Glass fiber
Thermal Conductivity:
1.2W/m.k
Temperature Resistance:
-20-120℃
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION
  • Thermal Conductive Adhesive Tape 0.7mm 1.2W/m.k Fiberglass Reinforced for Heat Sink Bonding in Power Electronics & Battery Systems NFION

● Dual-Sided Adhesion: Provides strong, reliable bonding on both sides, capable of replacing screws and mechanical fasteners.

● Thermal Conductivity: Transfers heat efficiently with a thermal conductivity of 1.2W/m.k.

● Temperature Resistance: Operates effectively in temperatures ranging from -20°C to 120°C, suitable for a variety of environments.

● Tear Resistance: The fiberglass base offers enhanced durability and resistance to tearing.

● Strong Adhesion: Delivers excellent bonding strength to various surfaces.

● Electrical Insulation: Provides reliable electrical insulation to protect sensitive components.
Application method

● Surface Preparation: Clean and dry the surfaces to ensure they are free from dust, grease, and contaminants.

● Cutting and Peeling: Cut the tape to the required size, then peel off the protective liners from both sides.

● Positioning: Align and place the tape between the heat-generating component and the heat sink or other surfaces.

● Application of Pressure: Apply firm pressure to ensure a secure bond and full contact between surfaces.

● Setting Time: Allow the adhesive to set as per the recommended time for achieving maximum strength and performance.
Application
● Power Electronics: Ideal for securing heat sinks to power modules and converters.
● High-Performance Computing: Used in CPUs, GPUs, and other high-heat-generating computer components.
● Consumer Electronics: Provides effective thermal management in smartphones, tablets, and laptops.
● Automotive Applications: Secures components and manages heat in automotive electronic systems.
● Industrial Equipment: Enhances heat dissipation and component stability in various industrial machines and devices.
Specification
Testing ItemUnitTesting ValueTesting Method
Substrate-Glass Fabric-
Colour-WhiteVisual
ThicknessMM0.7-
Peel Strengthunder180°(PSTC-101)(N/25MM)>20PSTC-1
Retention(1KG/INCH/25℃)>48PSTC-1
AdhesionKG/IN1.5PSTC-1
Initial ViscosityKG/IN1.5PSTC-1
Breakdown VoltageKV/MM7ASTM D149
Long-termHighest Temperature resistance80EN 344
Short-termHighest Temperature120EN 344
Working Temperature-20~120EN 344
ConductivityW/M.K≥1.2ASTM D5470
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