● Exceptional Thermal Conductivity: With a thermal conductivity of 8.0W/M.K, this gel facilitates superior heat transfer, essential for high-power and high-density electronic components.
● Single-component Design: Simplifies the application process, eliminating the need for mixing and reducing the potential for errors, saving time and enhancing ease of use.
● Outstanding Thermal Stability: Maintains consistent performance across a wide temperature range, ensuring reliable operation in even the most challenging environments.
● Minimal Thermal Resistance: Features ultra-low thermal resistance at interfaces, maximizing heat dissipation efficiency between components and heatsinks.
● Non-corrosive and Safe: Safe for use in sensitive electronic environments, this gel is non-corrosive and free from toxic substances, ensuring reliability and safety.
● Automated Dispensing: Designed for seamless integration with automated dispensing systems, ensuring precise and efficient application in high-volume production.● Direct Manual Application: Can be easily applied using dispensing tools or spatulas for custom or smaller-scale applications.
● Immediate Use: Ready for immediate application without the need for curing time, facilitating quick and straightforward deployment.
● Reworkable: Easily removable and reapplicable, allowing for adjustments without compromising thermal performance.
● High-Performance Computing: Ideal for cooling CPUs, GPUs, and other high-performance computing components in data centers and high-performance computing environments. ● Telecommunications Infrastructure: Perfect for base stations, routers, and other telecommunications equipment requiring superior thermal management. ● Electric Vehicles: Essential for powertrain systems, battery management, and other automotive electronics demanding exceptional heat dissipation. ● Industrial Equipment: Suitable for power supplies, motor drives, and other industrial applications where effective thermal management is crucial for operational efficiency and safety. ● LED Lighting Systems: Ensures optimal heat dissipation in high-intensity LED applications, enhancing performance and extending the lifespan of LED modules.
| Feature | Value | Unit | Test Method |
| ThermalConductivity | 8.0(±0.5) | W/m·K | ASTM D5470 |
| Thermal Impedance | ≤0.15 | ℃-in^2/W | ASTM D5470 |
| Color | Grey | -- | Visual |
| Viscosity | 85*10^4 | mPa.s@25℃ | Rheometer DHR-2 |
| Density | 3.4(±0.5) | g/cc | ASTM D792 |
| Extrusion Speed | 20 | g | g/min(50Mpa) |
| 30 | g | g/min(100Mpa) |
| Flammability Rating | V-0 | -- | UL 94 |
| Working Temperature | -50~160 | ℃ | IEC 60068-2-14 |
| Breakdown Voltage | ≥7 | Kv/mm | ASTM D149 |
| Volume Resistivity | ≥1.0*10^11 | Ω·cm | ASTM D257 |
